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Yisiwei Board Level Packaging System Integrated Circuit Project - International Tender Announcement (1)

General Information

Countries:
China
Notice/Contract Number:
4197-2340CDECHEN1/48
Original Site Publication Date:
2024-04-25 00:00:00
Create/Change Date:
2024-04-26 09:22:09
Deadline:
2024-05-16 00:00:00
Original Language:
Chinese
Procurement Method:
International procurement
Notice Type:
Invitation for Bids
Notice Status:
Published

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Original Text

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If you have any updates,corrections,or complaints related to this notice, please contact the responsible purchaser directly.
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Date
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importer@dgmarket.com
2024-04-26 09:22:09
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